| Customization: | Available |
|---|---|
| Structure: | Multilayer FPC |
| Material: | Flex Material |
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Flex PCB Technology
| Item | Description | |
| Layer | Flex board: 1-8Layers | |
| Flex-Rigid Board: 2-10Layers | ||
| PI, PET, PEN, FR-4,trasparent PI,thick copper | ||
| Material | ||
| Flex board: 0.002" - 0.1" (0.05-2.5mm) | ||
| Final Thickness | Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm) | |
| Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | |
| Max / Min Board Size | Min: 0.2"x0.3" Max: 20.5"x13" | |
| Min Trace Width / Min Clearance | Inner | Outer |
| 1/3oz: 3/2mil | 1/3oz: 3/2mil | |
| 1/2oz: 3/3mil | 1/2oz: 3/2mil | |
| 1oz: 4/4mil | 1oz: 5/5mil | |
| 2oz: 5/7mil | 2oz: 5/7mil | |
| Min Hole Ring | 1/3oz-0.5oz: 4mil | 1/3oz-0.5oz: 4mil |
| 1oz: 5mil | 1oz: 5mil | |
| 2oz: 7mil | 2oz: 7mil | |
| Copper Thickness | 1/3oz - 2oz | |
| Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | |
| Min Hole Size and Tolerance | Min hole: 4mil | |
| Tolerance: PTH±3mil, NPTH±2mil | ||
| 24mil x 35mil (0.6x0.9mm) | ||
| Min Slot | ||
| Coverlay color | white,black,yellow,transparent | |
| Coverlay Alignment Tolerance | ±3mil | |
| Silkscreen Alignment Tolerance | ±6mil | |
| Silkscreen Line Width | 5mil | |
| Gold Plating | Nickel: 80u" - 120u" | Gold: 1u"-15u" |
| Immersion Nickel / Gold | Nickel: 80u" - 120u" | Gold: 1u"-3u" |
| Immersion Silver | Silver: 6u" - 12u" | |
| OSP | Film: 8u" - 20u" | |
| Test Voltage | Testing Fixture: 50-300V | |
| Outline: ±0.05mm | ||
| Profile | Coverlay: ±0.2mm | |
| Number of Layers | Rigid PCB: | 1-36layer | |
| Flexible board: | 1-6 layer | ||
| Flex-rigid board: | 4-10 layer | ||
| Maximum board size | 546mm*800mm | ||
| Laminate | FR4,FR-1, CEM-3, High TG, Aluminum base, Halogen Free, Rogers | ||
| Board thickness | thickness | 0.1-3.2mm | |
| Tolerance | +/-10% | ||
| Minimum track width | 3mil | ||
| Minimum track gap | 3mil | ||
| copper thickness | Outer layer | H oz ---10 oz | |
| Inner layer | H oz ---6 oz | ||
| Hole specication | Max. PTH/NPTH size | PTH:6.35MM NPTH: 6.35MM | |
| Min.hole size | PTH : 0.1MM NPTH : 0.2MM | ||
| Tolerance | +/-0.075MM | ||
| Aspect ratio | 8:1 | ||
| Surface Treatment (thickness) | Flash Gold | gold : 1-3u" ni: 100--250u" | |
| Immersion Gold | gold : 1-3u" ni: 100--250u" | ||
| Sn/PB HASL | 1---40um | ||
| Leadfree HASL | 1---40um | ||
| Immersion Silver | 0.1----0.4um | ||
| OSP (Entek) | 0.2---0.5um | ||
| Gold Finger | >=30u" | ||
| Immsion Tin | 0.8--1.2um | ||
| others | |||
| Plug via hole | Min. size | 0.1mm | |
| Max. size | 1.0mm | ||
| S/M pitch(IC to IC) | 16mil | ||
| Outline Profile | CNC Routing | +/-0.1mm | |
| punching | +/-0.1mm | ||
| V-Cut | +/-0.1mm | ||
| Impedance Control | +/-10% | ||
| Wrap and Twist | <=0.75% | ||
| Electric Strength | <15S (Spacing >=80um, voltage 500 VDC ; Spacing < 80um , voltage 250v | ||
| Peel Strength | according to IPC-6012B 3.10.5 | ||
| Solder Mask Abrasion | according to IPC-6012B class 2, Table 3-9 | ||
| Thermal Shock | additional risistance < 10% | ||
| Special Tech | Peelable mask, Carbon ink, Capton tape |
Advanced Manufacturing Technology
Equipped with state-of-the-art SMT (Surface Mount Technology) and DIP (Dual In-line Package) machinery, our facility can handle a wide range of components, from standard to fine-pitch and BGA (Ball Grid Array), ensuring high precision and efficiency in every assembly.
Strict Quality Control Processes
Quality is at the heart of our production. We use AOI (Automated Optical Inspection), ICT (In-Circuit Testing), and functional testing to ensure all products meet the highest standards. Our rigorous quality control systems comply with ISO and IPC standards, guaranteeing reliable performance in every batch.
Flexible Production Capacity
From low-volume prototypes to high-volume mass production, our factory is equipped to handle orders of all sizes. Our adaptable approach to manufacturing allows us to quickly scale production to meet the changing needs of our customers.
Experienced Engineering Support
Our team of skilled engineers offers full technical support from product design to final assembly. We work closely with clients to optimize designs for manufacturability, reliability, and cost-effectiveness, ensuring a smooth and efficient production process.
Efficient Supply Chain Management
We have strong partnerships with reputable component suppliers, ensuring stable and timely supply. Our efficient supply chain management minimizes lead times and allows us to offer competitive pricing without compromising on quality.
Comprehensive Testing Capabilities
We implement comprehensive testing procedures, including burn-in, X-ray inspection, and ESD (Electrostatic Discharge) protection testing, ensuring that every PCBA is thoroughly tested and reliable in diverse operating conditions.
Customer-Centric Approach
Our commitment to customer satisfaction is reflected in our flexible service offerings, fast response times, and tailored solutions. We work to build long-term partnerships with our clients by consistently delivering high-quality products and dedicated support.
Environmental Responsibility
Our factory operates under environmentally friendly practices, including waste reduction and energy-efficient operations. We are fully compliant with RoHS and REACH standards, ensuring our products are environmentally safe and sustainable.
Packing &Shipping
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